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| SPD18P06P G SIPMOS (R) Power-Transistor Features * Product Summary Drain source voltage Drain-source on-state resistance Continuous drain current P-Channel Enhancement mode Avalanche rated dv/dt rated 175C operating temperature VDS RDS(on) ID -60 0.13 -18.6 V W * * * * A Pb-free lead plating; RoHS compliant Type SPD18P06P G Package PG-TO252-3 Pin 1 G PIN 2/4 D PIN 3 S Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol Continuous drain current Value -18.6 -13.2 Unit A ID T C = 25 C T C = 100 C Pulsed drain current ID puls EAS EAR dv/dt -74.4 150 8 6 kV/s mJ T C = 25 C Avalanche energy, single pulse I D = -18.6 A , V DD = -25 V, RGS = 25 W Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt I S = -18.6 A, V DS = -48 V, di/dt = 200 A/s, T jmax = 175 C Gate source voltage Power dissipation VGS Ptot Tj , Tstg 20 80 -55...+175 55/175/56 V W C T C = 25 C Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev 3.4 Page 1 2008-09-02 SPD18P06P G Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. max. 1.85 100 75 50 K/W Unit RthJC RthJA RthJA - Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. -3 max. -4 A -0.1 -10 -10 0.1 -1 -100 -100 0.13 nA V Unit V(BR)DSS VGS(th) IDSS -60 -2.1 VGS = 0 V, I D = -250 A Gate threshold voltage, VGS = VDS I D = -1 mA Zero gate voltage drain current VDS = -60 V, V GS = 0 V, T j = 25 C VDS = -60 V, V GS = 0 V, T j = 150 C Gate-source leakage current IGSS RDS(on) - VGS = -20 V, VDS = 0 V Drain-source on-state resistance W VGS = -10 V, I D = -13.2 A 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Rev 3.4 Page 2 2008-09-02 SPD18P06P G Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Transconductance typ. max. Unit gfs Ciss Coss Crss td(on) 4 - 8 690 230 95 12 860 290 120 18 S pF VDS2*I D*RDS(on)max , ID = -13.2 A Input capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Output capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Reverse transfer capacitance VGS = 0 V, V DS = -25 V, f = 1 MHz Turn-on delay time ns VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Rise time tr - 5.8 8.7 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Turn-off delay time td(off) - 24.5 37 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Fall time tf - 11 16.5 VDD = -30 V, V GS = -10 V, ID = -13.2 A, RG = 2.7 W Rev 3.4 Page 3 2008-09-02 SPD18P06P G Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Gate to source charge typ. max. Unit Qgs Qgd Qg V(plateau) - 4.4 9.3 22 -5.56 6.6 14 33 - nC VDD = -48 , ID = -18.6 A Gate to drain charge VDD = -48 V, ID = -18.6 A Gate charge total VDD = -48 V, ID = -18.6 , V GS = 0 to -10 V Gate plateau voltage V VDD = -48 , I D = -18.6 A Parameter Reverse Diode Inverse diode continuous forward current Symbol min. Values typ. -1 70 139 max. -18.6 -74.4 -1.33 105 208 Unit IS ISM VSD trr Qrr - A T C = 25 C Inverse diode direct current,pulsed T C = 25 C Inverse diode forward voltage V ns nC VGS = 0 V, I F = -18.6 A Reverse recovery time VR = -30 V, IF=I S , di F/dt = 100 A/s Reverse recovery charge VR = -30 V, IF=l S , diF/dt = 100 A/s Rev 3.4 Page 4 2008-09-02 SPD18P06P G Power dissipation Drain current Ptot = f (TC) SPD18P06P ID = f (TC ) parameter: VGS 10 V SPD18P06P 90 -20 W 70 60 A -16 -14 Ptot ID 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160C 190 -12 -10 -8 -6 -4 -2 0 0 20 40 60 80 100 120 140 160C 190 TC TC Safe operating area Transient thermal impedance I D = f ( VDS ) parameter : D = 0 , T C = 25 C -10 2 ZthJC = f (tp ) parameter : D = tp /T tp = 29.0s SPD18P06P 10 1 SPD18P06P K/W 10 0 A Z thJC 100 s ID 10 -1 -10 1 D = 0.50 10 1 ms DS /I -2 D 0.20 0.10 0.05 DS (on ) =V R 10 -3 10 ms 0.02 0.01 single pulse DC -10 0 -1 -10 -10 0 -10 1 V -10 2 10 -4 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 VDS Rev 3.4 Page 5 tp 2008-09-02 SPD18P06P G Typ. output characteristic Typ. drain-source-on-resistance I D = f (VDS); T j=25C parameter: tp = 80 s SPD18P06P RDS(on) = f (ID ) parameter: VGS SPD18P06P -50 Ptot = 80.00W VGS [V] a 0.42 A -40 -35 h l -4.0 -4.5 W a b c d e f g h 0.36 0.32 jk i b c d e -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -9.0 -10.0 -20.0 RDS(on) -5.0 0.28 0.24 0.20 0.16 i ID -30 -25 -20 -15 -10 -5 0 0 g f g fh e i j k d c l 0.12 0.08 k l j b a VGS [V] = 0.04 a b c d e f -4.0 -4.5 -5.0 -5.5 -6.0 -6.5 g h i j k l -7.0 -7.5 -8.0 -9.0 -10.0 -20.0 -1 -2 -3 -4 -5 -6 -7 -8 V -10 0.00 0 -4 -8 -12 -16 -20 -24 -28 -32 A -38 VDS ID Typ. transfer characteristics I D= f ( V GS ) Typ. forward transconductance VDS 2 x I D x RDS(on)max parameter: tp = 80 s -40 A gfs = f(ID); Tj=25C parameter: gfs 10 S 8 -30 7 ID -25 gfs V 6 5 4 3 -20 -15 -10 2 -5 1 0 0 0 0 -1 -2 -3 -4 -5 -6 -7 -8 -10 -5 -10 -15 -20 A -30 VGS ID Rev 3.4 Page 6 2008-09-02 SPD18P06P G Drain-source on-state resistance Gate threshold voltage RDS(on) = f (Tj) parameter : I D = -13.2 A, VGS = -10 V SPD18P06P VGS(th) = f (Tj) parameter: VGS = VDS , ID = -1 mA -5.0 V -4.4 -4.0 W RDS(on) 0.38 0.32 0.28 0.24 0.20 V GS(th) -3.6 -3.2 -2.8 98% 0.16 -2.4 -2.0 -1.6 -1.2 -0.8 max typ 0.12 0.08 0.04 0.00 -60 typ -0.4 -20 20 60 100 140 C 200 0.0 -60 -20 20 60 100 140 V min 200 Tj Tj Typ. capacitances Forward characteristics of reverse diode C = f (VDS) parameter: VGS=0V, f=1 MHz 10 4 IF = f (VSD ) parameter: Tj , tp = 80 s -10 2 SPD18P06P pF A 10 3 -10 1 C Coss 10 2 IF -10 0 Ciss Crss Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 1 0 -5 -10 -15 -20 -25 V -35 -10 -1 0.0 -0.4 -0.8 -1.2 -1.6 -2.0 -2.4 V -3.0 VDS VSD Page 7 Rev 3.4 2008-09-02 SPD18P06P G Avalanche energy Typ. gate charge EAS = f (Tj) para.: I D = -18.6 A , VDD = -25 V, RGS = 25 160 VGS = f (QGate ) parameter: ID = -18.6 A pulsed SPD18P06P -16 mJ V 120 -12 E AS 100 VGS -10 0,2 VDS max 0,8 VDS max 80 -8 60 -6 40 -4 20 -2 0 25 45 65 85 105 125 145 C 185 Tj 0 0 4 8 12 16 20 24 28 nC 34 QGate Drain-source breakdown voltage V(BR)DSS = f (Tj) SPD18P06P -72 V -68 -66 -64 -62 -60 -58 -56 -54 -60 V(BR)DSS -20 20 60 100 140 C 200 Tj Rev 3.4 Page 8 2008-09-02 SPD18P06P G Package outline: PG-TO252-3 Rev 3.4 page 9 2008-09-02 SPD18P06P G Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev 3.4 Page 10 2008-09-02 |
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